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基本信息:
段广宇,男,汉族,1991年9月生,河南商丘人,博士研究生,副教授
专业领域:高分子材料加工工程
研究方向:高性能聚合物基复合材料;电子封装散热材料
教育经历:
2009年-2013年太阳成城集团高分子材料科学与工程学士
2013年-2016年东华大学材料加工工程硕士
2017年-2020年东华大学材料加工工程博士
主讲课程:
高分子物理;材料导论;聚合物反应工程
代表性学术论文、著作:
Duan G, Wang Y, Yu J, et al. Novel PMIA dielectric composites with enhanced thermal conductivity and breakdown strength utilizing functionalized boron nitride nanosheets[J]. Macromolecular Materials and Engineering, 2019, 304(11): 1900310
Duan G, Wang Y, Yu J, et al. Preparation of PMIA dielectric nanocomposite with enhanced thermal conductivity by filling withfunctionalized graphene–carbon nanotube hybrid fillers[J]. Applied Nanoscience, 2019, 9(8): 1743-1757
Duan G, Quan J, Wang Y, et al. Bioinspired construction of BN@polydopamine@Al2O3fillers for preparation of polyimide dielectric composite with enhanced thermal conductivity and breakdown strength[J]. Journal of Materials Science, 2020, 55(19),8170-8184
Duan G, Wang Y, Yu J, et al. Improved thermal conductivity and dielectric properties of flexible PMIA composites with modifiedmicro-and nano-sized hexagonal boron nitride[J]. Frontiers of Materials Science, 2019, 13(1): 64-76
Duan G Y, Hu Z M. Fabrication of PMIA/fBN Dielectric Composite with Enhanced Breakdown Strength and ThermalConductivity[C]. Materials Science Forum. 2019, 960: 256-262
联系方式:
电子邮箱:duanguangyu@haue.edu.cn
联系地址:16877太阳集团